SEMICON India 2026 Day 2 Records 25 Key Semiconductor Announcements and Collaborations

The second day of SEMICON India 2026 saw 25 major announcements and collaborations spanning semiconductor manufacturing, advanced packaging, materials, logistics, chip design, power electronics and workforce development, highlighting expanding activity across India’s semiconductor ecosystem.

The event has drawn strong participation from the global semiconductor industry. Nearly 12,000 visitors attended the first day, most of them industry participants, while the exhibition features more than 600 exhibitors, including around 300 international companies.

Addressing the media, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said participation increased on the second day, with strong business-to-business engagement and several agreements concluded during meetings. Country pavilions also recorded significant participation, with more than 30 companies each from Japan and Singapore, along with companies from South Korea and European countries including Belgium, the Netherlands and Sweden.

Vaishnaw said the participation reflected growing international interest in expanding semiconductor-related activities in India. He also pointed to investment interest emerging at the event, with companies indicating plans to scale up investments based on their ability to execute projects.

Supply Chain Localization

Strengthening the domestic semiconductor supply chain emerged as a major theme on Day 2.

Tata Electronics signed agreements covering high-purity gases, advanced chemicals, materials, engineering systems and semiconductor packaging. Its collaboration with INOX Air Products will focus on strengthening the domestic supply of high-purity gases required for semiconductor manufacturing.

A separate partnership with Sumitomo Chemical will support localization of high-purity wet chemicals and advanced materials for front-end semiconductor manufacturing. Tata Electronics also partnered with Kelington Engineering for gas distribution systems, high-purity piping and process-tool hook-up for semiconductor fabs.

Tata Electronics and Enomoto will collaborate on advanced semiconductor packaging and the localization of lead-frame manufacturing through joint research and development.

The Centre for Materials for Electronics Technology (C-MET), Pune, and Hindalco Industries have also signed an MoU aimed at scaling critical raw materials for the semiconductor ecosystem and strengthening domestic material capabilities.

Semiconductor Logistics

Logistics was another important component of the announcements.

The India Semiconductor Mission (ISM) and Nippon Express Holdings signed an MoU to strengthen semiconductor logistics infrastructure and supply chains. The collaboration will bring expertise in logistics, warehousing, customs and related services as semiconductor manufacturing expands in India.

The partnership is intended to address the specialized transportation and handling requirements of semiconductor materials and equipment while supporting a more resilient supply chain.

Power Electronics and AI Infrastructure

Several announcements focused on power electronics, renewable energy and infrastructure for artificial intelligence.

The Ministry of Electronics and Information Technology, Ministry of Power and POWERGRID will collaborate on the indigenization of Silicon Carbide power modules for Voltage Source Converter-based high-voltage direct-current transmission systems. The technology will initially be piloted at POWERGRID’s 1,000 MW Pusauli project in Bihar.

L&T Semiconductor Technologies announced multiple collaborations covering power electronics and connected systems. Its partnership with Virtual Forest will focus on solutions for air-conditioning and solar-powered systems, while its collaboration with Newen Systems will explore Silicon Carbide power modules for renewable energy systems and AI data centres.

L&T Semiconductor Technologies will also work with Fimer India on Insulated Gate Bipolar Transistors for renewable energy applications and with Capital Power Systems on IoT modules for smart meters, beginning with an indigenous 4G communication module.

Another strategic agreement between Tata Electronics and L&T Semiconductor Technologies will explore manufacturing L&T semiconductor products at Tata Electronics’ fab and OSAT facilities, beginning with consumer-grade camera modules.

Indigenous Semiconductor Products

One of the key announcements was the launch of India’s first indigenous System-on-Module (SoM), the ISC-VEGA-SOM, developed by IndieSemiC and C-DAC.

The module integrates C-DAC’s VEGA Thejas32 processor with IndieSemiC’s globally certified LoRa RF module. Developed under C-DAC’s Industry Support Centre initiative, the product represents an example of Indian semiconductor design moving towards commercial products.

The announcement also highlighted the role of the government’s Design Linked Incentive programme in supporting domestic semiconductor design companies.

The SoM development is part of a broader effort to move Indian semiconductor capabilities beyond chip design towards products and systems that can be integrated into commercial applications.

Advanced Packaging and Semiconductor Manufacturing

Kaynes Semicon and IndieSemiC announced an OSAT collaboration covering qualification, assembly and testing of advanced packages such as QFN and BGA, along with customized System-in-Package development.

Kaynes Semicon, Microchip Technology and GridCrest Technologies will explore an India-based pathway for energy-metering system-on-chip products.

Another partnership between Kaynes Semicon and United BC Team will focus on developing a phased roadmap for advanced intralogistics and lights-out semiconductor manufacturing.

These collaborations are aimed at strengthening India’s capabilities in semiconductor assembly, testing, packaging and automated manufacturing.

Deep-Tech Investment

The India Deep Tech Alliance (IDTA) reported investments of US$263 million across 56 Indian deep-tech companies, highlighting growing investor interest in emerging technology ventures.

IDTA and SEMI also announced collaboration to develop the India Semiconductor Academy, an industry-led national platform for workforce development. Partners include Cadence, CG Semi, Dixon Technologies, Micron Technology, Synopsys, 3D Glass Solutions, UC San Diego and IIT Kanpur.

Expanding Semiconductor Education

Several announcements on Day 2 focused on semiconductor education and professional training.

NIELIT and Siemens EDA signed an MoU to expand semiconductor design education through access to industry-grade electronic design automation tools and specialized training.

NIELIT also partnered with Tata Electronics to develop an industry-ready workforce for assembly, testing, marking and packaging operations, while another agreement with Singapore Polytechnic International will strengthen semiconductor education and training and promote India-Singapore cooperation.

NIELIT and the Semiconductor Laboratory (SCL) launched an indigenous 0.8-micron Open-Source Process Design Kit (PDK) on the NIELIT eChipHub platform. The initiative is intended to provide students and innovators with greater access to chip-design resources.

Further agreements involving NIELIT, the India Electronics and Semiconductor Association, SEMI University and other partners will support workforce development, certification and faculty training.

Advanced Design Tools for Startups

Silvaco and C-DAC’s ChipIN Centre also announced collaboration to provide access to advanced Technology Computer-Aided Design tools to startups and MSMEs participating in the Design Linked Incentive programme, along with C-DAC research and training initiatives.

Such tools are used in semiconductor development to model and analyze device and process technologies, supporting design and research activities.

Focus on Sustainability

Vaishnaw also highlighted sustainability measures being adopted across the semiconductor and digital infrastructure sectors.

He pointed to extensive water recycling in semiconductor fabrication facilities and closed-loop cooling systems in data centres as examples of resource-efficient approaches. With semiconductor manufacturing and AI infrastructure requiring significant water and energy resources, such technologies are becoming an important part of infrastructure planning.

The Minister also emphasized opportunities for Indian entrepreneurs, noting that companies entering the semiconductor ecosystem would need to compete globally on cost and quality while considering manufacturability, product life cycles and power consumption.

Global Participation

SEMICON India 2026 is being held at Yashobhoomi in New Delhi from September 17 to 19. The event features more than 600 participating companies and is expected to attract around 50,000 visitors.

Representatives from 52 countries, more than 400 executives and over 150 speakers are participating in the event. Six country pavilions represent Japan, South Korea, Malaysia, the Netherlands, Singapore and Sweden, alongside 12 state booths.

The exhibition also includes a Startup Pavilion, Innovation Showcase, Student Hackathon and Workforce Development Pavilion.

The 25 announcements on Day 2 cover multiple layers of the semiconductor value chain, from raw materials and logistics to chip design, fabrication, packaging, power electronics and education. Together, they indicate a broadening of India’s semiconductor activity from individual projects towards a more integrated manufacturing and technology ecosystem.